NettetIn electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection that passes completely through a silicon wafer or die.TSVs are … Nettet12. apr. 2024 · To start, the firms plan to focus on optimizing Intel 18A for mobile system-on-a-chip designs. In the future, Intel and ARM say their partnership could extend to silicon designed for use in cars ...
How Intel Makes Semiconductors in a Global Shortage - New York …
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Intel announces silicon photonics advancement towards optical I/O
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